High-density laser perforation involves using the energy from a laser to make tiny holes in sheets, films, or plates. The process begins with a laser that generates a pulse at a fixed repetition rate. Then a beamsplitter is used to convert the single laser beam into a controlled array of high-intensity beams that perforate the material with holes up to 5 microns in diameter. A rotating web carries the material set for perforation to specified locations for each laser pulse. As a result, high-density laser perforation offers precision cutting, high throughput, and accurate positioning. Unlike mechanically powered perforation techniques, no working residue is left on the Laser Perforation material.

Laser Perforation Materials

Resonetics seamlessly integrates high-density laser perforation solutions into medical device manufacturing processes for all kinds of devices and technologies. We can produce a variety of shapes in unlimited patterns from an array of materials, including:

  • Silicone pressure-sensitive adhesives
  • Acrylic pressure-sensitive adhesives
  • Polyester films
  • Cotton, both dense and loosely woven